Mittelstandspresse
05.08.2026
Rehm Thermal Systems at EFX 2026: Practical Expertise and Innovative Solutions for Electronics Manufacturing
Blaubeuren-Seissen, 05.08.2026 (PresseBox) - How can companies make their electronics manufacturing operations more efficient, sustainable and highly automated? Rehm Thermal Systems will provide answers to these and other key questions from October 6 to 8, 2026, at the inaugural EFX – Expo for Electronics Manufacturing in Stuttgart.
In Hall 9, Booth 9C19, trade visitors can look forward to a varied program covering modern manufacturing processes, reflow soldering, automation, digitalization and connected production solutions. The focus will be not only on new technologies, but above all on the specific challenges encountered in day-to-day production.
As a launch partner and member of the Exhibitor Advisory Board, Rehm Thermal Systems has actively supported the development of the new event format from the outset. Working together with Messe Stuttgart and other industry representatives, the company is contributing its many years of experience in electronics manufacturing to establish EFX as a forward-looking platform for knowledge transfer, innovation and face-to-face exchange.
The new industry event addresses key topics shaping the future, including smart manufacturing, digitalization, automation and sustainability. Manufacturers, users and partners will have the opportunity to learn about the latest developments, share experiences and jointly develop new ideas for competitive electronics production.
Expert Knowledge for Day-to-Day Production
On all three days of the trade fair, Rehm Thermal Systems will offer a varied program of practical technical presentations and personal discussions. The company’s experts will demonstrate how processes can be systematically optimized, resources used more efficiently and employees prepared for new requirements.
The following topics are on the program:
Qualifying Your Employees
Walter Seng, Rehm Academy
Greater Efficiency and Reduced Resource Consumption in Reflow Soldering
Dr. Paul Wild, Head of Research and Development, and Julian Klaiber, Head of Internal Sales
Preventing Coating Defects: Identifying Causes and Systematically Optimizing Processes
Gianfranco Sinistra, Director Sales Conformal Coating & Dispensing
Everything You Were Afraid to Ask About Soldering
Helmut Öttl, Technical Process Consultant
ViCON Connect, ViCON App and ViCON Aide: Digital Support for Your Processes and Production Control
Rehm software specialists
Rehm Line Automation Concepts
Lisa Leonhardt, Senior Manager Line Solutions
Integrated Solutions for Connected Production Lines
Gianfranco Sinistra, Rehm, and Markus Scheid, Managing Director of RESITCO GmbH
The program combines in-depth expertise with practical ideas for day-to-day production. Visitors will be able to discuss their individual questions directly with the specialists and work with them to develop potential solutions for their manufacturing operations.
Personal Exchange Through Bar Talks and Networking
The experts will also be available for discussions away from the Rehm booth. During the Bar Talks at the EFX Café and EFX Bar, participants can explore selected topics in greater depth in an informal setting, gain new perspectives and make valuable contacts within the electronics industry.
Wednesday, October 7, 2026 | 10:00 a.m.
EFX Bar Talk: Ensuring Coating Quality—Optimizing Material Handling and Process Conditions, Avoiding False Alarms
With Gianfranco Sinistra, Rehm Thermal Systems, and Michael Zahn, Koh Young Europe GmbH
Wednesday, October 7, 2026 | 4:00 p.m.
EFX Café: Soldering Consultation
With Helmut Öttl and Dr. Paul Wild, Rehm Thermal Systems
Thursday, October 8, 2026 | 11:45 a.m.
EFX Bar: Increasing Efficiency Through Automation and Connectivity
With Gianfranco Sinistra, Rehm Thermal Systems, and Markus Scheid, RESITCO GmbH
“As a launch partner and member of the Exhibitor Advisory Board, we have supported EFX with great commitment from the very beginning. The new format provides the industry with an excellent platform for sharing knowledge, engaging in dialogue and jointly developing new ideas. Through our program, we aim to make technological solutions clear and tangible, discuss specific practical challenges and provide inspiration for more efficient and future-ready electronics manufacturing,” explains Carmen Hilsenbeck, Head of Marketing at Rehm Thermal Systems.
As a specialist in thermal system solutions, Rehm helps companies implement reliable, high-performance and cost-effective production processes. Its portfolio includes solutions for reflow soldering, drying, curing and coating, as well as automated and connected manufacturing processes.
At EFX 2026, visitors will be able to discuss their individual requirements with Rehm’s experts, learn about new technologies and take away practical ideas for advancing their electronics manufacturing operations.
Rehm Thermal Systems at EFX 2026
October 6–8, 2026
Messe Stuttgart
Hall 9, Booth 9C19
https://www.messe-stuttgart.de/efx/en/
Please find attached the following image materials: EFX banner and key details of the Rehm booth. (Images provided for communication purposes by EFX, Messe Stuttgart and Rehm Thermal Systems.)
Ansprechpartner
Carmen Hilsenbeck
+49 (73) 449606-535
+49 (73) 449606-525
Zuständigkeitsbereich: Leiterin Marketing
Über Rehm Thermal Systems GmbH:
Rehm Thermal Systems is an expert in joining technologies for electronics manufacturing. With innovative system solutions for soldering, drying, and coating, we enable our customers to create reliable connections on electronic assemblies – tailor-made, process-safe, and future-oriented.
Since 1990, we have been developing and manufacturing energy-efficient production equipment to the highest quality standards at our headquarters in Germany and at an additional production site in China. Our global subsidiaries and distributors provide customized solutions and competent service – wherever electronics are made.
Create your Connections – with Rehm, you shape the joining technology of tomorrow.
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EFX banner
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